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Industry Sources Confirmed

Tue, 02/14/2012 - 12:04AM by seeboy 0 Comments - 2 Views

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Sony's acquisition of the US health care Micronics companies to accelerate product research. This is Sony's first acquisition of a medical device developers.
Sony said in a statement, Micronics in Redmond, Washington in the United States, developed for disease diagnosis, care monitoring and blood testing equipment. Sony did not disclose financial terms of the deal.
ChisatoKitsukawa Sony spokesman said the acquisition is Sony's first to enter the medical device industry. Sony to provide health care agencies screen, camera and printer. Sony is considering expanding the field of health care in the way. Sony's CD-ROM and other electronic technology can be used in this area.
Micronics Founded in 1996, has been RiverCitiesCapitalFunds other investment companies, and some personal financial support. The company has 30 employees.
A number of TD industry sources confirmed that the TD terminal sales in the second half of a sudden heavy volume greatly increased, TD chips in short supply, is expected to end in order to change.
Sun Wang, president of TD-SCDMA terminal chips, the largest supplier of Core Technology Alliance, in a guest Sina interview said, "TD-SCDMA, in the first half of this year, we feel that sales is still very good, but after the second half, we found that TD chip demand leaps and bounds, as if suddenly began heavy volume.
He said, "Now, whether it is the LCI or several other Friends of the providers have recently appeared in the TD-chip stock of the situation, that is, for on the goods, this situation is a bit beyond our expectations, from the first half of downturn in the second half of a sudden heavy volume growth. From this point, we deeply realize that the TD-SCDMA terminal chip manufacturers, the real spring is coming ".
TD Industry Alliance Secretary-General Yang Hua, Sina Technology interviews also confirmed the existence of a TD chip to outstrip supply. His analysis, it should be early TD market development, as expected, chip manufacturers in the stocking of the chip and its lack, terminal manufacturers, the number on the stocking of the devices are relatively small and ill-prepared, when the sudden outbreak of TD terminal market.
Yang Hua, think, another reason is, 56 months, the field of TD terminal launched thousands of intelligent machines, such as ZTE's TD thousands of smart phones U880 began to be available in May of this year sales up to now exceeded one million Taiwan, but I believe the beginning of November, the TD terminal and chip supply situation will be a greatly improved ".
Sun Wang, Chief Technology Officer of LCI also said that the development of 3G market situation is changing in 2011, the pattern of TD-SCDMA Industry has also undergone great changes, the proportion of TD terminal of channel sales more accounted for the greater the Leadcore 4 TD terminal chip, so far, based on these chips has now reached 70 a variety of mobile phone project is being developed.
Recently, sensing industry research director of the Center in 2010 fifth Guangdong and Hong Kong radio frequency identification (RFID) Technology Forum, Xiao-Fei Zhang said, as to constitute the basic unit of Things sensor chip 90% rely on imports. The next few years, the situation is still mainly rely on imports can not be reversed, but three years later made chips share up to 30%.
Zhang Xiaofei, said the current lack of Internet of Things in leading enterprises. As of the end of July this year, domestic listed companies and the Internet of Things related to about 30, but only a business associate associated with business income to a maximum of only 170 million yuan, accounting for only a small part of the turnover.
According to market research of the senior engineers sensing Research Institute (GSII), the world has 80 percent of the leading sensor manufacturers to enter the Chinese market. The global sensor market volume of approximately $ 53 billion in 2009, is expected to the world sensor market size up to more than $ 66 billion in 2010.
GSII 2009, the size of the sensor market demand growth was primarily driven by industrial electronic equipment, automotive electronics, communications, electronics, consumer electronics and special electronic equipment. Industrial electronics and automotive electronics is the fastest growing industries in China's electronic information industry is also a sensor applications area with the most 1/3 of total sensor market in both sensor applications. GSII is expected that the Chinese automotive sensors market sales will exceed $ 1.5 billion in 2010.
In recent years,rocker switch China's auto industry was sustained rapid growth, the rapid development of China's auto market in 2009, annual sales of 13.64 million. China Passenger Car Association forecast sales in 2010 will reach 17 million, to maintain 21% growth rate. , An ordinary car is about to install more than 100 sensors, the limousine sensor even up to more than 200.

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Ministry of Science and High Technology

Mon, 02/13/2012 - 12:14AM by seeboy 0 Comments - 1 Views

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Zhang Zhihong, Deputy Director of the Ministry of Science and High Technology Division, recently revealed that the "Eleventh Five-Year" period, the Ministry of Science and Technology will be saving and new energy vehicles as major projects and to invest 2 billion yuan. "But it is precisely this $ 2 billion to start our new energy automotive industry, "according to last year's survey results show that only in the field of new energy automotive batteries, China is not fully invested already more than 8.5 billion yuan, said Zhang Zhihong.
To promote the new energy automotive industry, Zhang Zhihong, the Ministry of Science and Technology will adhere to the "three vertical and three horizontal" research and development layout, fully integrated national science and technology resources, promote the industrialization of research and development. First, is the core technology, the key core technologies and components such supporting facilities; second, to continue in-depth demonstration and extension, the focus is to explore the business model of sustainable development for new energy vehicles; third, to increase the charging infrastructure technological innovation, speed up infrastructure construction, charging infrastructure and our demonstration of the 25 cities to promote close; Fourth, to further speed up the technical standards to improve the standard system; support the formation of the industrial base Innovation Alliance foster strategic emerging industries, research topics proposed by the Ministry of Science and special support to the Combination, Industrial Technology Alliance to bear the national mission; Sixth, we must continue to improve the public service platform, strengthen personnel training.
Chen Qingtai, former deputy director of the State Council Development Research Center, First, China should implement the policy of both constraints and incentives; Second, the reform of fuel tax; Third, the electric car is difficult to become the highlight of the recent earnings, but the industry The gestation period is to compete for industry leadership position is the most important period.
Suntech CEO Zhengrong Shi, the Chairman of the Board said Wednesday that in 2015 there are at least half of the countries in the world will achieve grid parity, while China will become the world's largest PV application market.
Dr. Shi said that the difficulties faced by the PV industry will improve in the next two years, because after the bottoming out of the solar energy prices, the market demand for solar energy will begin to recover. He also predicted that by 2015 at least half of the countries in the world can achieve grid parity.
Some analysts said that the power generation costs of PV systems is still high in most markets solar power costs are almost four times that of traditional energy. Improve the photovoltaic cell conversion efficiency, sustained reductions in PV prices will give solar energy cost competitive continuous improvement.
Zhengrong Shi said, China will also benefit and is expected to continue to lower the price of photovoltaic products in 2015, China will surpass Germany as the world's largest PV application market.
Some analysts said that parts of solar electricity in Germany and Italy have parity,rocker switch mainly due to falling prices of photovoltaic products.

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The Solar Cell Market

Thu, 02/09/2012 - 11:37PM by seeboy 0 Comments - 2 Views

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The solar cell market this year, dark clouds, but there may be even worse. According to Solarbuzz surveys indicate that many solar cell manufacturers to prepare revised production plan, but the well-known Chinese companies are still in accordance with the annual delivery plans to maintain production. If the second half of 2011, continue to the planned outputs, then the solar cell module shipments than demand exceeds 4.4GW. The trend of increased inventory of solar cells next year will be difficult to suppress.
It is understood that the solar cell module continues in the state of overproduction, factory supply prices fell 33 percent compared to 2010. Price decline, the 2011 second quarter of many well-known solar battery manufacturers, fab supplier and polycrystalline silicon manufacturers decline in gross margin by more than 50% of%.
However, rising inventories caused by price declines will probably not stop. The supply price of crystalline silicon solar cells, is expected to decline 18% in the fourth quarter of 2011. By the stimulus impact of this price reduction, it is estimated that the thin-film solar cell module price will have fallen sharply.
Solarbuzz noted that the increased market demand due to falling prices is beginning to show, but later than expected. Solarbuzz president CraigStevens warned the fastest early 2012, the German electricity purchase price will be lowered 15%, if the overestimation of future demand, then the value of the inventory will be further reduced.
It is understood that the solar cell manufacturers are prepared to allow the 2012 production capacity of more than 2011 more than 50%. However, it is expected that demand will only increase by 25%. Stevens said that this situation last year caused the price collapse of the solar cell supply chain as a whole. Profit has reached the vertex, it is expected that the case of mergers and bankruptcies of the 2012 solar cell manufacturers will further increase.
Nvidia most of the new 28nm mobile GPU chip is using Kepler Kepler framework, but there are some lower-end products may also leave the shadow of some of the the Fermi fees architecture, of course, more important is that these 28-nanometer mobile GPU chips have to wait until 2012 in order to be officially listed.
Having said that, we still do not know the exact time to market for mobile GPU chip of Nvidia's 28 nanometer architecture, but industry insiders believe that Nvidia's next-generation 28nm mobile GPU chip is likely to be with Intel's next-generation 22-nanometer IvyBridge architecture chip synchronization sale. In fact Nvidia's purpose may be to launch 28-nanometer GPU chip, along with the corresponding IvyBridge architecture MahoBay platform and to further gain market Optimus intelligent switching graphics. If this is indeed the case, Nvidia's next-generation 28 nanometer mobile GPU chip time to market is likely to ultimately depend on Intel, and Intel platform will be launched in March 2012 or April.
But for Nvidia in terms of its 28-nanometer mobile GPU chips might be in December this year, mass production, which means that the appropriate product so far has been silicon success some day. However, TSMC's 28 nanometer manufacturing process is not as imaginary so perfect,rocker switch because the current yield of the process is not good, and this is quite critical for the success of a chip to market and profitability.
In addition to the mobile version of the 28 nm GPU Kepler, 28 nm of the desktop version of Kepler in 2012 officially listed, do not even rule out the mobile version and desktop version of 28 nm Kepler will be listed in the same period.

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Investment-driven Industry

Thu, 02/09/2012 - 1:24AM by seeboy 0 Comments - 2 Views

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Construction machinery industry is a fixed-asset investment-driven industry, is closely related to its development and economic business cycle, a barometer of economic development. In 2009, domestic investment in fixed assets reached 22.5 trillion yuan, 3.2 trillion yuan in 2000, an increase of 5.8 times. Period, the market scale of the construction machinery industry increased by 5.46 times. Therefore, to predict the future size of the market, the macroeconomic and long-term situation, especially the basic trend of the financial and monetary policies have a clear judgment and grasp.
Rather cautious view of a number of investment institutions. Recently, most of the research fund analyst in the enterprise that the second quarter of this year may become a turning point of the construction machinery industry growth. Their views are reflected in the real economy will be based on the follow-up impact of the fall as well as national macroeconomic regulation and control of fixed asset investment growth, which affects the market demand.
Data show that the first two months of 2011, domestic new projects with total investment decreased 23.6 percent year-on-year, fixed asset investment in the implementation of the project reduce the number of over 15,000. Analysts believe that The amount of fixed asset investment growth in the second quarter, the possibility of further decline. Recently published industry data shows: April, the nation's leading construction machinery excavator sales ring dropped significantly by about 50%, loaders and bulldozers total sales were down 30% and 48.9% respectively. Analysts believe that appear lower than the previous, in addition to seasonal fluctuations, macroeconomic policy shift is a major factor. This seems to provide some basis to fund the company's point of view.
In fact, the China Construction Machinery Industry Association, during the second five industry growth rate has been reduced. Expected to be 2010 to 2015, engineering machinery sales total annual increase of about 17% in the past five years, the construction machinery industry average annual growth rate of 33%. Analysts believe that GDP growth does not appear significantly decline under the premise of the construction machinery industry in the next few years the average growth rate of about 20% is more reasonable.
Face of such a scale in the market, the current situation is no need to guess who is going to dinner, all the world's strong construction machinery giants have gathered in this. And, without exception, the market as to maintain their livelihoods and the pursuit of development a top priority. The recovery of the different economic regions there are significant differences in the emerging markets become the focus of attention.
In Europe, in the second quarter of 2010, the euro-zone economy to achieve a 1% sequential growth, the fastest in four years. This is mainly due to the economy, led by Germany, France and other major economies. Within the euro area's economic competitiveness of the great differences and the different flexibility of the labor market, increasing the imbalance of the economic crisis in member countries. Differentiation of the economic recovery in the euro zone, its internal deficit and debt problems have become more serious. This will be the euro-zone medium-and long-term economic growth, a great deal of uncertainty. Therefore, sales of construction machinery market in Europe is also unstable. Clearly,mig welder the European construction machinery must rely on exports to relieve stress. The German Engineering Federation (VDMA) actively encourage the manufacturers of construction machinery and equipment out of the country, the implementation of the localization strategy, in particular, continue to encourage its enterprises to invest and build factories in China.

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Threshold Voltage Where

Mon, 02/06/2012 - 12:31AM by seeboy 0 Comments - 2 Views

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Furniture into the trend for "non-for-not" lead to hot

RF MEMS switches in the isolation, insertion loss, power consumption and linearity, with the incomparable advantages than traditional FET or pin diode microwave solid-state switch, which gained wide attention, and shows great in the field of microwave applications potential. Since 1979 KEPetersen first reported the application of RF MEMS switches, the industry has developed many different structures of the RF MEMS switch. Both in isolation and insertion loss, RFMEMS capacitive shunt switch in the Ka to W-band show a good performance. However, RF MEMS capacitive switches, lower isolation in the low frequency limit in the X-band applications. To overcome the above shortcomings, JBMuldavin switch beam and the ground plane between the high-impedance transmission line series inductance introduced by the transmission line so that the LC resonant frequency of the X-band range, and obtained better than X-band isolation performance of -20 dB. JYPark such as the design of RF MEMS capacitive shunt switch using the dielectric constant of 30 ~ 120 SrTiO3 as the dielectric layer, by increasing the switch is closed the state capacitor value switch is better than -30 dB isolation at 10GHz. The M.Tang etc. under the CPW electrodes placed by KOH etching, the depth of the 1.6μm substrates basin-shaped slot, won the 10 to 13 GHz frequency, -16.5 ~ -28 dB, the isolation of a single switch, two The isolation of the switch cascade of -25 to -35 dB. In this paper, a CPW transmission line and coplanar waveguide ground plane of the substrate groove, isolation and applied to the X-band RF MEMS capacitive shunt switch. The design does not change the switch structure and circuit structure on the basis of improved isolation performance of the switch, high-performance circuit design for RF MEMS-based CPW structure provides a reference. 1 switch design Design and Analysis of microwave characteristics of 1.1 switch In this paper, the design of capacitive shunt switch structure shown in Figure 1. Circuit using coplanar waveguide (CPW) structure, the switch at the end of two anchor areas were fixed on the two ground planes of CPW switch beams by plate girder structure, located in the CPW transmission line side 2 μm at. Stubs high impedance line can increase the series inductance of the switch the switch beam and ground plane, thereby reducing the resonant frequency, to achieve higher isolation in the X-band frequency range. In this paper, the CPW transmission line and ground plane between the introduction of two depth of 20 μm substrate groove. CPW transmission line theory, when the circuit structure in (b) shows the CPW transmission line width W increases, the transmission line and ground plane spacing G reduce the distributed capacitance of CPW CCPW increases, Based on the above analysis, the CPW, the characteristic impedance decreases with the increase of the width of the transmission line. [7], [8] on the substrate groove of the analysis, keep the circuit geometric parameters do not change, the CPW, the characteristic impedance with increasing groove depth increases. Therefore, we can not change the case of the characteristic impedance of the transmission line to increase the width of the CPW transmission line by selecting the appropriate groove depth, which can effectively reduce the signal attenuation due to conductor loss due to transmission line. Switch equivalent circuit model, in which the output characteristics of the the Z0 CPW transmission line input impedance; C is the capacitance between the switch beam and transmission lines, with the switch state change; the LS and RS were equivalent inductance and resistance of the switch beam ; series inductor L1 is the the stubs high impedance line between the switch beam and ground plane introduced. Switch the resonant frequency f0 is given by equation (5), where L is the total series inductance. This article stubs high impedance line optimized design size is 150μm × 60 μm, and the switch in the closed state, the resonant frequency of 13.5 GHz. In addition, the increase of the CPW, the transmission line width also increases the contact area of ​​RF MEMS switches in the drop-down state when the transmission line above a dielectric layer, thereby increasing the short-circuit capacitance of the RF signal by the switch in the off-state, help to improve the isolation . (A) shows, when the switch is in the state, smaller on-state capacitance between the beam and the transmission line, the formation of the RF signal to open. Figure 2 (b) below, when the switch is in off-state, the contact part of the transmission line is 150 nm thick Si3N4 dielectric layer isolated DC voltage and closed-state capacitance, the RF signal to form a short circuit. (A) In this paper, the design of π-type tuning switch circuit, the substrate groove in the transmission line between the ground plane in Figure l, and z is high impedance transmission line length and width. (B) its equivalent circuit model. π-type matching circuit, while the broadband matching, but also appropriate on-state capacitance, a high degree of isolation. High impedance transmission line is located between two parallel switch can achieve impedance matching. isolation under the π-type tuning circuit-state can be approximated as: And Cd in the closed-state capacitance, βl and Zh for the high-impedance transmission line electrical length and impedance. When the DC bias voltage applied between the center conductor of the switch beam and transmission line, the electrostatic beam away from the downward movement of the initial equilibrium position. When the DC bias voltage reaches the threshold voltage, the switch down to 2/3 of the initial spacing of the upper and lower electrodes into the unstable state, and switch quickly attracted induced closure, pull-in "phenomenon. Among them,rocker switch the threshold voltage Where: k is the equivalent coefficient of elasticity of beam; ε0 is the dielectric constant of air; W for the width of the CPW center of the transmission line; ω switch the width of the beam center plate; g0 for the beam and electrode spacing. Equivalent spring constant k can be expressed as Where: E is the Young's modulus of beam material; t is the thickness of the elastic beam; Lm is the length of the beam; σ is the residual stress of the beam; v is the beam material, Poisson's ratio.

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Professional Power Amplifier Switching

Thu, 01/05/2012 - 11:44PM by seeboy 0 Comments - 2 Views

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Modern switching power supply technology is on an unprecedented scale transformation of the traditional old electrical equipment, broad access to the national economy and all areas of human life. It has a power density, small size, light weight, high efficiency, high reliability and low noise, low pollution fine quality, which greatly saves energy, reduces material consumption and cost, significantly reducing electromagnetic interference. Like the present in our daily life in the popular "inverter air conditioner," "section of the source more than 40% of the refrigerator", and industrial common "arc welding, electrolysis, heat, charge, ultrasound, motor speed," and so high-tech value-added products, is that the use of high-frequency switching power supply technology results!
We now look back: our modern high-frequency high-power switching power supply technology, in fact, a wide knowledge, span large, difficult, risky and complex technology, it can provide strong power grid and coarse power, transformed into a variety of electrical equipment and instruments required for high stability and fine precision electric power, which provides a different voltage and current specifications, it is important in modern electronic devices the central supply system. There are statistics that: in the common faults in electrical equipment, nearly half of the power issue, I think this can not be overemphasized. Because modern high-frequency switching power supply is concerned with across multiple disciplines, such as micro-fine processing is probably the intelligent control chip system, and the growing power of the updated high-performance power devices and high-frequency transformer magnetic materials, amorphous and micro- crystal field, etc., is the case, it is sufficient to prove the technology's high-tech value is beyond the reach of general business. Because of the time, few will be launched in this elaborated.
I am talking about professional power amplifier switching power supply: that is, in the modern high-frequency switching power supply based on the lifting of the large loop feedback, eliminating the need for regulators to adjust the switching pulse width caused by the switching rate dips the formation of the power amplifier output power large dynamic moment of lack of contradiction a new power supply. It is a new development without feedback, no regulator, and a good load-driving capability of the patented floating technology FPA special brand of professional power amplifier switching power supply, which is the subject of my talk today.
FPA Professional amplifier dedicated support "high-frequency switching power supply" addition to the above advantages, the more unique of the soft turn-off and soft AC power factor correction (PFC) circuit unit, absolutely put an end to the switch and the impact of pollution on the grid, the AC power utilization increased by 40% or more. For over voltage, overload, short circuit and other measures to improve the protection circuit is also another highlight of this power. In addition, use of intelligent limiter circuit to ensure that the machine at different load (1Ω-16Ω) under different power are completely eliminated clipping. Also, the machine load range, in the long-term stability 2Ω load can still work, and therefore a wider adaptability. It also has a bridging function, advanced temperature control system; It is worth mentioning that it also has the sensitivity of the input signal to the machine with automatic adaptation (0dB ~ +20 dB), ability to adapt to a variety of more powerful sources . The power of the maximum output power in the 4000-5000W, the maximum current output DC voltage power supply products as: ± 75V, ± 150V, unilateral current 30A, fully meet the specialized second-order Class H power amplifier, the power amplifier output with the corresponding : 8Ω/85V the 950W continuous effective power, 4Ω/70V that effective 1200W continuous power,rocker switch this amplifier corresponds to the FPA's model for the brand CE1200, weighing only is the traditional 1 / 4, 2U chassis. As the application of the switching power supply of professional power amplifier embodies many advantages, it represents the development direction of professional power amplifier, professional power amplifier is currently another masterpiece.

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Performance Measurement Method

Mon, 12/26/2011 - 10:48PM by seeboy 0 Comments - 2 Views

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In computing and consumer electronics products, the efficiency has been significantly improved, with emphasis on AC / DC conversion. However, with the 80 PLUS, Climate Savers and EnergyStar 5 and other specifications, designers began to realize, AC / DC and DC / DC power system needs improvement.
AC / DC average system efficiency of 65%, while the DC / DC average system efficiency of 80%, it is easy to understand why we focus on the AC / DC system. However, it should re-examine DC / DC system, to identify new ways to improve efficiency.
Computing, communications and consumer applications in the DC / DC converter is responsible for the management and distribution of power for the graphics card, processor chips and memory and other functions to provide power, and all of these features are faced with demands to improve performance, and therefore more than ever require higher efficiency. MOSFET has been studied using the latest developments and advanced thermal packaging technologies to improve the existing circuit switches the power transistors and associated device efficiency.
Careful selection of power components, especially the vehicle of the synchronous buck converter, the new platform can dramatically improve power density, efficiency and thermal performance. For example, if there are 50 million servers are fully consistent with the requirements of 80 PLUS energy, then energy savings enough to supply over 377 000 households electricity.
Circuit and loss
Buck or synchronous buck circuit is that all low-voltage DC / DC power management system, heavy-duty components, and all synchronous step-down circuit from the main power MOSFET switching losses and conduction losses.
In any desktop computer can be found in common buck rectifier (VRM), shown in Figure 1, the rectifier at full load can provide more than 25A of output current and 1.2V. Therefore, one will be located in the main channel MOSFET high-side or slot, and two parallel MOSFET or the bottom slot in the flywheel. The 12V input to 1.2V output buck, then the duty cycle is 10%, so the high-side MOSFET switching losses will be adjusted to low, and low-side MOSFET on will RDS (ON) adjusted to a minimum, to minimize the conduction wear and tear.
Discrete MOSFET drive and multi-phase VRM VCORE program to achieve the typical peak efficiency is 90%, in each phase at rated current 10A, and 30A at full load current, the efficiency decreased to 85%. For today's designers, the complete output of VRM systems typically 100W, efficiency of 85%, meaning that power dissipation of 15W.
The gradual improvement of silicon-based MOSFET
MOSFET manufacturers are mainly two ways to optimize the process of development. First, in order to improve the switching characteristics of the product (switching speed), they implemented an advanced gate design, reducing gate charge (Qg) effect. Second is to increase the cell density, that is, the same size chip, on-resistance significantly reduced. RDS (ON) MOSFET conduction loss and current are the two determinants of conduction loss formula is simple:
Ploss = I2 × RDS (ON) conduction losses
Ploss = 1/2V × I × (Tr + Tf) × F switching losses
Figure 2 shows the Fairchild Corporation ≤ 30V N-channel MOSFET cell density of progress. Each bar is that new technology advances. Can be seen in the last decade, the cell density from 32 million units / square inch to the current 10 million units / square inch.
MOSFET performance factor
In the industry, the performance measurement method used is the coefficient of performance is always (FOM), and fundamentally, this is only considering the transistor on-resistance and gate charge.
FOM = RDS (ON) × Qg
RDS (ON) directly related with the conduction losses, switching losses and Qg directly related. The smaller the FOM, the better the performance.
Figure 3 shows the development of low-voltage MOSFET process FOM progress. For implementation in 2004 PowerTrench3, the best FOM is 240, and today's best silicon PowerTrench5 FOM is 126.
Unfortunately, FOM decreased by 50% does not mean MOSFET loss decreased by 50%, because their relationship is not linear. However, through careful selection and optimization, today's MOSFET can still significantly reduce system power loss.
System-level efficiency
Therefore, the power MOSFET is a DC / DC power circuit in the power loss of the culprit, through the use of advanced devices, the losses can be substantially reduced. So the overall efficiency of this system, what kind of relationship?
Designers look for ways to improve the load are low, medium, high, within the scope of the entire machine system efficiency. At full load, such as the computer starts or treatment process is busy, the power system, the dominant conduction losses. Simply select the RDS (ON) MOSFET is smaller can significantly reduce losses. Very interesting is that most PC at work most of the time period used in standby or sleep state, so low-load efficiency is very important.
Figure 4 shows the actual efficiency of map data from the desktop power module phase rectifier column. The four curves is the two different MOSFET devices at 300kHz and 550kHz at the result. We can see the entire load current range efficiently.
Note that the above two curves, the full load (30A), you can see the latest device efficiency improvement of 1.5%. The same or two curves, the load is small (15A), you can achieve the 0.69% improvement. If the points for the entire load range, then compared with the common scenario today, the latest MOSFET devices using the average power loss can be reduced by 8% to 10%. Even in the high switching frequency 541kHz, they may see the system-level efficiency in the load hours is still higher than 80% efficiency at full load is greater than 70%. If the frequency continues to increase, then the switching losses will increase dramatically.
Most DC / DC converter is the best operating frequency 250 ~ 300kHz, because the frequency of the resulting switching losses and conduction losses can be affordable, and the output ripple to the load low enough. Operates at 250kHz below the efficiency will be higher, but the deviation of the output voltage may be too large, it can not be used to power Pentium chipset.
The same idea can be used to power laptop processor, game consoles, set top box can also be used in consumer electronics and other household products, despite their much smaller current. Energy savings for each mW looks difficult. However,rocker switch it can be for today's environmental problems caused by global improvement. Small number of methodological improvements will have a significant effect.

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Load Switching Circuit

Tue, 12/20/2011 - 12:32AM by seeboy 0 Comments - 2 Views

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Basic circuit load switches
Power MOSFET is a device with good switching characteristics: on-resistance when the RDS (ON) is very small; in the off leakage current IDSS is very small. In addition, its wide voltage range, from tens to hundreds of V V, drain the power range from a few tens of A to A, so it is suitable for load switching.
N-channel MOSFET can be composed of simple load switch, shown in Figure 1. Load connected between the power supply and drain (load can be DC motors, cooling fans, power LED, incandescent bulb or solenoid coil, etc.). Add a gate in its logic high level, the N-MOSFET turns on, the load was electric; plus a gate in its logic low, the N-MOSFET off, the load loss of power.
MOSFET switch with a load consisting of
It can be seen from the load switch is connected between the power supply and load, with the logic level to control the pass, off, or loss of the load energized electrical power devices. As the bottom of the load switch, commonly referred to as the low-end load switch.
If the load is a grounded circuit required (such as power amplifier, transmitter or receiver circuits, etc.), the low-load switch can not be used, to the use of high-side load switch. High-side load switch is composed mainly by the P-channel MOSFET, shown in Figure 2. Figure 2 (a) is a P-MOSFET with an inverter formed, Figure 2 (b) is a P-MOSFET with a N-MOSFET formed. Switch in the top of the load, said high-side load switch.
High-side load switch
(A) to illustrate how it works. In the inverting input of the input logic high, its output is low, the output of the inverter and the P-MOSFET gate connection, make-VGS ≈ VIN, P-MOSFET turns on, the load was electricity; if the inverter input logic low input, inverter output is high, then so-VGS ≈ 0V, P-MOSFET off, the load loss of power. Generally tend to answer it in the input pull-up resistor, and its purpose is to enable the load switch in the absence of a reliable control signal input in the OFF state.
(B) works in Figure 2 (a) the same, readers may own analysis.
Load switching circuit connected load
If the load switch and the load of a large-capacity capacitor indirectly, shown in Figure 3. When the capacitor's equivalent series resistance is very small, the load switch turn-on moment, there is a large transient current (inrush current, as shown in Figure 3 right) flow through the switch. To reduce the impact of current, an increase in the load switch in the C1 and R2, shown in Figure 4. When the load switch turn-on after an instant, the input voltage through the P added to the tube on the C1 and R2 (Q1-resistance negligible), the main voltage drop on R2, reduced-VGS, reduced ID current, which reduces the impact of current. C1 ≤ 1000pF, R1 = 10 ~ 47kΩ, R2 = 1 ~ 4.7kΩ.
Basic circuit load switches
The basic load switch circuit. As the circuit is very simple, can be discrete components, but there are ready-made integrated circuits, to make application easier, accounting for a smaller PCB area.
The development of the load switch
From basic load switch circuit point of view, which is characterized by simple structure, the disadvantage is the lack of thermal protection (a local short circuit or output load short circuit). Not only in a short-circuit load, the load switch is damaged, and due to power overload shutdown would make the whole device, the system does not work. Therefore, in recent years, people under the applications of the load switch made many improvements, improved performance, improved operational reliability, increased functionality.
1 in security protection
① increase in the load switch in thermal shutdown circuit. If there is a load short circuit or partial short circuit occurs, the load switch overheat the die temperature exceeds the threshold temperature (eg 125 ℃), the thermal shutdown circuit work load switch off. Not only prevent more damage to the load, but also short-circuit power supply is not affected by the load to other circuits. In overheat fault occurs, the load switch is also output fault signal (to the microprocessor μP) to inform the presence of faults. Another input under-voltage lockout protection.
② increase in the load switch current limit circuit. No load switch output current sensing and limiting circuit. It has two structures: limit the current value is factory set; current limit resistor to set a user peripherals. Over-current condition occurs when the load switch output fault signal.
Output current limiting load switch, not only improve the reliability and safety, and this can also be used as a load switch power distribution switches, hot-plug socket, USB port. Some loads will switch the output latch when an overcurrent (no output), then the load switch can be seen as "electronic fuse" the exclusion of over-current fault, restart after work. Some of the load switch in overcurrent to limit the current (constant current) to continue to load.
2 in the switch performance
As semiconductor process technology, a single discrete MOSFET on-resistance has decreased resistance may be a few small mΩ. Integrated load switch MOSFET on-resistance in the larger, the current can be tens of mΩ so. In order to improve switching performance, the switch slow start (slow start switch is turned on, the voltage rate of rise of a slope, prevent excessive inrush current), fast turn-off. There are several voltage rising slope: the slope from the factory setting of several (different start time) for users to choose; peripheral device by the user in a capacitor, set the start time. For fast turn-off switch, load switch-off in output has set the discharge circuit, shown in Figure 5. The load switch is off, N-MOSFET conduction, capacitor discharge pipe to the N, accelerated turn-off time.
Load switch in the effective discharge of the output circuit
3 other
Portable electronic products in order to meet application needs for load switching, has been improved in the following areas: operating voltage for the battery supply voltage, usually 1.8 ~ 5.5V or 1.2 ~ 5.5V; to meet the lower voltage, the minimum input voltage is 0.8V; reduce quiescent current, typically a few μA (quiescent current size of the internal circuit and the load switch load degree), typically 1μA. Individual is relatively simple load switch, the quiescent current IQ = 25μA; output current is generally 0.2 ~ 6A, a variety of portable requirements; to meet the requirements of small portable load switches in a small package, SOT-23 package commonly used , 2mm × 2mm of the MLP or MLF package, SC-70 package, the smallest 6-ball BGA package, the package size of only 1.5mm × 1.0mm; the power is off, no reverse current.
Application of basin extension
Load switch is a universal power switching device, the past, mainly used in industrial control and automotive industry. In recent years, with the development of portable electronic products, such as PDA, mobile phones, digital cameras and other delicate products in large market, in order to save energy, in addition to the use of high efficiency power management IC, but also require multiple load switch, by the microprocessor load management to control the composition (in different working conditions, gave a useful load, will not load all off). Figure 6 is a schematic load management. In the figure, power management IC has 5 outputs (3-way DC / DC converter, 2 LDO). DC/DC1 output for the three parallel load 1 load 3. In order to control the load power or 1 to 3 of power, with three loads in DC/DC1 plus access between three load switch (load switch 1 to 3), terminated its control microprocessor I / O port, the Microprocessor control of their pass, off to load management.
Load management topology
Increase the load switch current limit function can be used as computer peripherals power port (USB), and can be made into hot-swappable power outlet can also be made of the power distribution switch.
Adjustable output current limit circuit to the USB port
Is an adjustable output current limit circuit to the USB port. The circuit is made by the MIC2008 Power distribution switch, the USB controller to achieve control of power distribution switches. The current limit set by the peripheral resistance R (restricted current range of 0.2 ~ 2.0A). The power distribution at the output voltage slew rate (start time) set by the capacitor C peripherals, internal over-temperature protection and low input voltage when the output latch protection.
Introduction to typical load switch
In recent years, FAIRCHILD company, ANALOGIC TECH company, MICREL companies have developed a variety of new load switch. Because of these features than the full-load switch, it is called "Keys" or "smart switch." This brief FAIRCHILD company FPF2163/4/5 and ANALOGIC TECH's AAT4297 load switch.
1 FPF2163/4/5 Series
FPF2163/4/5 series load switch is a multi-function output load current can be set to switch. The Series Main features: Input voltage 1.8 ~ 5.5V; the current limit can be set to the range of 0.15 ~ 1.5A; input voltage below the threshold voltage, the output latch (UVLO); a thermal shutdown; a maximum of 77μA quiescent current (typical), switch off power consumption is less than 2μA; occur undervoltage lockout, overtemperature, overcurrent fault, a fault signal output; switch off when no reverse current; small FET-6 package (2mm × 2mm); working temperature? there are some differences, as shown in Table 1. Users can choose according to product requirements.
The series load switch is mainly for PDA, mobile phones, GPS, MP3 players, digital cameras, peripheral ports and hot-swap power supplies. FPF2164 can be used as "electronic fuse."
FPF2163/4/5 pinout
The series of pin arrangement shown in Figure 8, the typical application circuit shown in Figure 9.
FPF2163/4/5 Typical Application Circuit
In the input capacitor CIN is 1μF, the output capacitor COUT to 0.1μF, 10kΩ for the fault signal output pull-up resistor (internal open-drain output structure), RSET is the current limit setting resistor, current limit set by ILIM and RSET is given by:
RSET = 275.6/ILIM
Where, RSET unit of Ω, ILIM of unit A. Set the current limit of a certain tolerance, the tolerance range of ± 25%.
Increase in the ON-side logic high (VIN = 1.8V at> 0.8V, VIN = 5.5V at> 1.4V) when the switch is turned on; a logic low level in the ON side (VIN = 1.8V when <0.5V, VIN = 5.5V at <1V), the switch is off.
2 AAT4297
AAT4297 is a load for the phone to control the LED switch. There are a lot of the phone LED, use them as monochrome or color LCD backlight display, keyboard, LED lighting and camera flash. There are some dual-display screen and keyboard backlight vice can change its color to suit different customer favorite. This is some of the different working conditions of LED control LED can be used to load a new type of switch management, which is the AAT4297. It except for mobile phones, but also can be used for multiple small power load switches, personal communication devices and other portable electronic products, load management.
The main features of the device: the input voltage range of 1.8 ~ 5.5V; internal communication has six low-N MOSFET switches, each is independent; can use a single serial control line (S2C line) achieved through the various switches, off control; low quiescent current, typically 3μA; each switch can drive 208mA; without any external components; 12-pin TSOP package; operating temperature range of -40 ~ +85 ℃.
AAT4297 pin diagram
The block diagram of the device shown in Figure 10. EN / SET to enable / switch to select the side, and the μP's serial port connection, input 6-bit digital signal (000000 ~ 111111) rear high, allow up to six switches 64 different pass, off the state. VCC 1.8 ~ 5.5V input voltage, S1 ~ S6 for the switch drain (open-drain output structure), external LED load. If the input signal is a six-digit post-high, add 6 LED (LED1 ~ LED6) are bright; if the input digital signal is 010011, then LED1, LED3, LED4 off, LED5, LED6 light, when the EN / SET end into the signal from high into low, all the LED lights are off.
AAT4297 Typical Application Circuit
The typical application circuit shown in Figure 11. S1 ~ S3 then three primary colors (RGB) LED, RR, RG, RB, for the colors of LED current limiting resistor. Use red, green, blue combination of three different light colors, can produce seven different colors. For example, red, green and blue LED light in a certain light intensity, can produce white light; red and green LED lights can produce orange light. And if necessary can take more than one RGB LED. S4 D1 ~ D4 then White LED, it is used as a color main display backlight, S6 then flash LED, flash for camera use.
Different working conditions based on the phone from μP to EW / SET input of different digital signals, enabling the LED load management. Digital signal frequency up to 1MHz. Use input EN / SET signal the LED light off time and time alternate, changing light, the time off, adjust the LED brightness can be achieved.
See, only one serial control line μP can achieve all of the LED load management, and change color and adjust the backlight brightness, the LED load rotary switch device features and performance is very good, it is commonly used in mobile phone fashion load management IC.

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Electrical Switching Characteristics

Wed, 12/14/2011 - 11:25PM by seeboy 0 Comments - 1 Views

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On switching power supply, a number of books specifically written switching power supply is not understand a few words can say. But before someone asked me some questions, now think of it, to sum up.
1, the duty cycle of switching power supply
Beginners are always with input voltage duty cycle do not understand the relationship between the output voltage. The buck-type, for example, because Vout = D * Vin, so someone will consider how the input voltage and output voltage to change the duty cycle. Difficult to answer this question let me.
Duty cycle is changing, but not the output voltage and input voltage variations. Switching power supply chip and chip linear voltage regulator, are based on feedback to stabilize the output. Will be calculated on the DATASHEET chip output voltage formula, as long as the piezoelectric resistance according to the formula you can get points, do not have to consider is how to adjust the duty cycle within.
Designers need to be noted that the duty cycle range. Not all chips can reach 100%, only 90 percent majority, or even lower. So need to input voltage range and output voltage, calculate the required duty cycle is not within the scope of the chip.
2, switching power supply structure
There are a variety of structures.
Down (buck) type, the output voltage is lower than the input voltage, the most common type of structure;
Boost the output voltage higher than input voltage;
Polarity reversal, usually a positive voltage is input, output negative voltage;
Automotive in common of the three, if it is required a large input voltage range, sometimes higher than the output voltage, sometimes below the output voltage can be re-buck boost, SEPIC-type structure can also be used.
Specific types of calculations can refer to some of the chip data. Linear Technology's silicon materials, simple in principle, a more detailed formula column, also in the culture as well, there are many recommended circuit; National's also, data on the chip may not be detailed, but the principle of Application Notes described in many University as well as their simulation, but unfortunately there is no Chinese version.
, The synchronous rectifier
There is a buck-type switching current freewheeling diode in parallel with a diode in the MOS. This is used for synchronous rectification.
Because the diode conduction time, even Schottky diodes, voltage drop there are about 0.3V, the efficiency requirements in high places, this is not allowed, so to further reduce the pressure drop. This method is, in the diode conduction time, and will also parallel MOS MOSFET, to reduce the pressure drop, reducing the loss of purpose.
Why not remove the diode? Because of the MOS tube conduction takes time, can not be fully synchronized with the diode. Complete turn in front, MOS tube voltage drop across greater. This time, the freewheeling diode is still required.
Incidentally, in addition to adding a MOS synchronous rectifier tube, the synchronous rectifier controller or boost controller than BUCK expensive, so the cost of priority products in use caution.
4, the transformer.
This is a forward or flyback change device, SEPIC type sometimes used.
The most common buck or step-up switching power supply has the advantage of simple, the disadvantage is only one output. More often we need a few different outputs, so that the transformer will be much more convenient time, a group of multi-coils can be wound.
Transformer coil winding method, the choice of the core is a steep learning curve, I did not understand before, not much written
Switching power supply design, but it is still a lot to engage the head. But no matter what the circuit, as an application, as long as understand the basic structure, regardless of how future changes are not clear. Basic circuit, as long as the design or debug several times, the basic principle should also be understood.
Switch structure
Wide range of switches, switch system configuration also vary, depending on the efficiency of the final design of switching systems. Also consider when the system is integrated with the cable connection between switches and other requirements. Here are some basic block diagram of the switch.
A switch structure (Figure 2) can be described as the electrical switching characteristics of the mechanical structure, or its function in the test system.
The signal connected on the electrical connection or circuit description, circuit or connection for the test system described is necessary. Matrix switch (Figure 3) is the most commonly used switching system type. But first, do not confuse the host matrix switch with the switch - the switch matrix switch with the host (often referred to as switching hosts). Using a matrix card can connect any input to any output, the card can be connected to a single use or internal use. Such a structure would make the complex and interconnected system connection to minimize and simplify the interface to the DUT.
The example in Figure 3 on the DUT need to use four different instruments to test 10 different test points. If every time you have to connect several instruments to test a number of test points at the same time, then you need a matrix switch card. However, if each one only need to connect a test instrument to test the point, you can combine a 1 minute 4 1 multiplexer and a multiplexer configured to sub-10 this structure. The multiplexer 14 relay matrix card if you choose, all the configuration that you need 40 relays. The use of multiplexer 26 to save your final relay. Careful planning will be able to design more rational and more economical switching system. Multiplexing switch (Figure 4) in the testing process used to connect more than one instrument to the DUT or multiple instruments to test a DUT. In order to expand the capacity of switching systems, often associated with multiplexing switch matrix switches or other structures used in combination, can provide additional isolation and reduce crosstalk between channels, or the composition of the special structure of the switching system.
(Figure 5) scan is a special card multiplexer, the switch card can be sequential or continuous closure, and sometimes also has the ability to skip some of the channel closed. Isolating switch is unrelated relay switch components, often more than one pole, isolated switch is not connected to any other circuit, so it can be easily combined into a flexible and unique input / output structure, of course, require some additional external connections. This type of switch is usually used to increase the isolation between the circuit to provide safety interlock, drive a relay or other circuit, or combination of topologies such as special: the binary ladder or tree structure.
Electrical indicators
In a test system, the electrical switch card index of the overall system performance and signal integrity play an important role, so that the whole system when trying to achieve high accuracy, resolution, sensitivity, or high-frequency signal through the card , high current, high voltage signal, you need to master electrical switch card index. Switch card index system generally can not be used as indicators, to consider the key requirements for system testing. If it is required to test the 1V reference voltage signal of 1 microvolt accuracy, that is certain is that exposure to EMF can not switch the card is a few hundred microvolts. When the control switch off the power supply must be considered when switching the current levels. When the test is less than 1k ohm resistor, the switch may be required to support four-wire method test.
Switch indicator card the card is only a single block performance. If the card is connected with another, the actual performance parameters such as bias current and the insertion loss in the entire system will be more than just a single block of indicators in the index card. Each additional card and the connector will cause system performance degradation. In some applications where the complete test system (including the switch indicator) may have to be considered.
Figure 6 describes a number of performance indicators, and under what conditions they can be applied to improve system performance. There are many other features to consider, depending on card type and the signal level,wlan antenna as well as the expected performance of the test system. Key parameters in accordance with the switch in the switch selection guide in the search. The actual number of switches for a variety of types of tests, you should make a choice before all of the switch card carefully to see its specifications. Keithley switch manual is very in-depth exploration of the switching characteristics and the factors affecting test performance.

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Power Switch K and E

Mon, 12/12/2011 - 12:19AM by seeboy 0 Comments - 1 Views

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Switch K to a certain time interval repeatedly on and off, in the switch K, the input power switch K and E through the filter circuit to the load RL, the entire switch is turned on during the Power E provides energy to the load; When the switch K is open, the input power cut off energy E will provide. Visible, providing energy to the load input power is intermittent, for the load to get the energy to provide continuous, switching power supply must have a storage device, the switch is turned to a part of the energy stored in the switch disconnected, the load release. The figure, the inductor L, capacitor C2 and diode circuit consisting of D, we have this feature. Inductor L to store energy when the switch is disconnected, stored energy in inductor L in the release to the load through diode D, so that the load has been a continuous and stable power, because the diode D to continuous load current, so called freewheeling diode. The voltage between the average EAB AB can be expressed:
EAB = TON / T * E
Where each switch is connected to a TON of time, T is the switching off of the work cycle (ie, switch on-time and off-time TOFF TON of and).
From the equation, change the switch on-time and duty cycle ratio, AB between the average voltage also will change, therefore, as the load changes and input voltage automatically adjusts the ratio of TON and T will cause the output voltage V0 remain unchanged. Change the duty cycle on-time TON and the proportion that is changing the pulse duty cycle, this method is called "time ratio control" (Time Ratio Control, abbreviated TRC).
Switching power supply is a voltage conversion circuit, the main content of the work is a boost and buck, widely used in modern electronic products. Because the switching transistor is always work in the "open" and "off" state, so called switching power supply. Switching power supply is a real oscillator circuit, this means converting electrical energy, not only used in the power circuit, the circuit in other applications are also common, such as LCD backlight circuit, fluorescent lighting. Compared with the transformer switching power supply with high efficiency, good stability, small size and other advantages and disadvantages are relatively small power, and the circuit will produce high-frequency interference, transformer feedback oscillator circuit, to produce a regular pulse current or voltage circuit called the oscillator circuit, transformer feedback oscillator circuit is able to meet these conditions, the circuit
Switching power supply is divided into, isolated and non isolated in two forms, where the main talk about isolated switching power supply topology, in the following, non-specified, refer to isolated power supply. Isolated power supply according to the different structure can be divided into two categories: forward-and flyback. Refers to the flyback transformer primary side turns on the secondary cut-off, transformer storage. The close of the primary side, secondary side conduction, the energy released into the work load of the state, generally conventional flyback power than single-tube, twin-tube is not common. Forward refers to the transformer primary side conduction while the secondary induced voltage output corresponding to the load, the energy passes directly through the transformer. According to specifications can be divided into conventional forward, including single-transistor forward, two-transistor forward. Half-bridge, the bridge circuit are all forward circuit.
Forward and flyback circuits have their own characteristics, the circuit in the design process to achieve optimal cost-effective, flexible to use.
Position sensor for brushless DC motor Hall sensor chip is divided into switch-type Hall element and locking-type Hall element two. For the motor industry, the two Hall sensor chip can be used to accurately measure the position of the rotor magnet. The two Hall sensor chip with the production of brushless DC motor performance, including the motor output power, efficiency and torque so there is no difference, and is compatible on the same motor controller.
Hall sensor in the proportion of the total cost of the motor is not high, but its role is very critical, so the motor manufacturers in the choice of Hall magnetic switch must be careful. Hall sensor selection
Control part to pay attention: high-impedance circuit connected to a weak signal as short as sampling the feedback loop, the processing time to try to avoid its interference, current sampling signal circuits, in particular, current control circuit, easy to deal with some unexpected bad of the accident.
Electronic enthusiasts to provide you with a switch socket selection method to help choose safe and practical switch socket. Now briefly introduce how to select switches and sockets it:
Terminals: a common and traditional screw terminal velocity to terminal two, the latter is more reliable, and the wiring simple and fast, as long as the wire into the terminal hole, connecting is completed, and will not fall off.
Switch hand: spring is generally a good switch hard to ensure reliable contact connection, reducing the contact resistance, so the on / off when you have more sense of strength. The general switch spring is very soft, even frequent switch in the middle of the handle to stop the phenomenon, resulting in security risks.
Fluorescence Switch: Fluorescence switch generally paint type and the power light emitting type (such as neon bulb), with the former lower prices, but light pink light in the outside world disappears soon run out of energy, can not play a role in the fluorescence, so regular vendors products commonly used power LED technology, long-term light.
Copper: When you purchase,wlan antenna product design requires not only reasonable, but also to ensure that copper has a certain thickness.

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